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Serial number Project Process capability and tolerance
Soft board Soft and hard board
1 Maximum processing size 250*500 250*500
2 Number of layers 8 10
3 Maximum and minimum finished board thickness Number of layers Minimum maximum Number of layers Minimum maximum
1  Layer 0.036mm 0.15mm 1  Layer
2  Layer 0.05mm 0.17mm 2  Layer 0.15mm 3.0mm
4 Layer 0.12mm 0.4mm 4    Layer 0.2mm 3.0mm
6 Layer 0.3mm 0.6mm 6    Layer 0.5mm 3.0mm
8 Layer 0.4mm 0.8mm 8    Layer 0.6mm 3.0mm
4 Minimum bore diameter PTH 0.1mm PTH 0.15mm
NPTH 0.1mm NPTH 0.15mm
5 Plate thickness ratio 5:1 5:1
6 Inner and outer finished copper thickness Inner layer 0.070mm Inner layer 0.070mm
Outer layer 0.1mm Outer layer 0.1mm
7 Minimum line width / line spacing Base copper12um 0.05mm Base copper12um 0.05mm
Base copper18um 0.055mm Base copper18um 0.055mm
Base copper35um 0.08mm Base copper35um 0.08mm
8 Protective film alignment Soft board part Hard board part
Cover film distance
           PAD unilateral
0.075mm Cover film is unilateral from PAD 0.075mm
Cover film distance line 0.075mm Cover film distance line 0.075mm
Retaining the cover film between PADs, PAD spacing 0.2mm Retaining the cover film between PADs, PAD spacing 0.2mm
9 Solder mask ink Anti-welding distance PAD single side 0.05mm Anti-welding distance PAD single side 0.05mm
Anti-welding line 0.05mm Anti-welding line 0.05mm
Anti-welding distance PAD single side 0.15mm Anti-welding distance PAD single side 0.15mm
10 Dimensional tolerance Drill hole tolerance 0.03mm 0.03mm
Aperture tolerance Hole tolerance 0.01mm 0.01mm
Hole tolerance 0.005mm 0.005mm
Dimensional tolerance 0.1mm 0.1mm
Spacing of the nearest conductor 0.15mm 0.15mm
11 Surface treatment Shen Jin YES YES
Shen Yin YES YES
Electric gold YES YES
OSP YES YES
Remarks Such as special materials can be up to 450 * 650
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